OpenLight to Highlight Heterogeneous Silicon Photonics at Four Key Global Industry Events
OpenLight's InP-on-silicon platform enables fully integrated photonic chips that reduce power consumption, footprint,
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OpenLight’s InP-on-silicon platform enables fully integrated photonic chips that reduce power consumption, footprint, cost and system complexity.
SANTA CLARA, CA, UNITED STATES, August 20, 2026 /EINPresswire.com/ — OpenLight, a leader in heterogeneous silicon photonics integration and custom Photonic Application-Specific Integrated Circuit (PASIC) design, today announced it will showcase its fully integrated silicon photonics platform at four major industry events this September: TGS China, CIOE, ECOC, and Microelectronics UK.
Across these events, the company will highlight how its heterogeneous indium phosphide (InP)-on-silicon technology enables highly integrated photonic chips that combine active and passive optical components on a single device, helping customers achieve improved performance, power efficiency and scalability.
Visitors to the company’s stands and presentations will learn how OpenLight’s Process Design Kits (PDKs) accelerate the development of next-generation optical solutions by providing access to a comprehensive library of integrated lasers, electro-absorption modulators, semiconductor optical amplifiers, photodetectors, and passive photonic building blocks. The platform supports a broad range of applications, including AI infrastructure, cloud data centers, telecommunications, sensing and optical computing.
“September presents an excellent opportunity to meet with customers and partners around the world and demonstrate how heterogeneous integration is advancing silicon photonics,” said Dr. Adam Carter, CEO of OpenLight. “Our technology enables a level of photonic integration that simplifies system design, improves performance, and helps customers bring innovative products to market faster.”
OpenLight technical and business development teams will be available throughout each event to discuss customer applications, custom PIC development, and the company’s expanding ecosystem of design and manufacturing partners.
September Event Schedule
• TGS China 2026 – September 8, 2026, at the Hyatt Regency Shenzhen Airport, Bao’an District, Shenzhen, China
• CIOE 2026 – September 9-11, 2026, in Shenzhen, China at the Shenzhen World Exhibition & Convention Center
• ECOC 2026 – Exhibition September 21-23 (conference September 20-24), 2026, in Málaga, Spain at FYCMA – Stand: 2105.
• Microelectronics UK 2026 – September 29-30, 2026, in London, UK at ExCeL London – Stand: S5.
To arrange a meeting with the OpenLight team at these tradeshows, please reach out to: sales@openlightphotonics.com
About OpenLight
OpenLight is a leader in the heterogeneous integration of III-V devices in silicon photonics. OpenLight’s world-leading PASIC technology, supported by its process design kit (PDK), integrates all active and passive components of silicon photonics devices into a single chip, enabling high-performance, energy-efficient photonics solutions across datacom, telecom, automotive, AI, and quantum computing applications and markets. The company’s recent $50 million Series A-1 funding round, bringing total funding to $84 million, reflects growing commercial momentum and accelerating customer adoption across next-generation photonics applications. The company is headquartered in Santa Barbara, California, with offices in Silicon Valley. Read more at www.openlightphotonics.com.
Mallory Robertson
Grand Bridges
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